SEMICON CHINA 2025

In the surging waves of the semiconductor industry, Hirokawa, with its cutting-edge semiconductor wafer transfer products and solutions, is about to make its appearance at SEMICON CHINA 2025. We sincerely invite you to join us in this technological feast of the semiconductor field!

Exhibition Dates: March 26-28, 2025
Exhibition Venue: Shanghai new international expo center
Booth Number: T3147

Semiconductor front-end automation equipment

High cleanliness
High capacity
High reliability
Customization

GVM series vacuum robots

Anti-corrosion features
Automatic deviation correction features
For high vacuum environments

Yaskawa motion control products

Advanced motion performance
High mechanical precision
Stable drive

Wafer pre-alignmen

High rotational accuracy and centering accuracy
High compatibility
High efficiency

Radio frequency identification system

A variety of frequency options
High scalability and flexibility
High compatibility

For more product details, please come to the booth for consultation and negotiation!

Join hands with Hirokawa, "heart" towards the future. From March 26th to 28th, Hirokawa is looking forward to meeting you at SEMICON CHINA 2025 in Shanghai, booth T3147. See you there!