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Hirokawa delivers transmission solutions for a wide range of semiconductor process equipment

Platform

The vacuum platform is a crucial transfer component in semiconductor vacuum process equipment, serving as the staging area within semiconductor process tools to transfer wafers among multiple chambers. Hirokawa’s vacuum platform can be integrated with multiple vacuum robots to meet the specific requirements of high vacuum process equipment such as etching, CVD, ALD, and electron beam inspection, enabling high-performance and highly stable wafer transfer.

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Single-chamber platform
  • High Cleanliness
  • High vacuum
  • Multiple docking methods for process tools
  • High accuracy
  • High throughput

Basic Specifications

Item Specification
Load Lock Quantity Customizable
Slot Customizable
Transfer chamber Processing surface Multiple methods
Vacuum Robot GVM3HDA/GVM3HQF
Vacuum pump Optional configuration
Vacuum performance 1E^-9 Torr
Transfer Accuracy ≤1mm
Polygonal Design

Other special types of Robot

Let us design a semiconductor wafer transfer technology solution tailored to your specific needs

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Please contact our team for additional information to help you find the right products and solutions for your next project.

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