Hirokawa delivers transmission solutions for a wide range of semiconductor process equipment
Vacuum Robots are essential core components in the transport of semiconductor vacuum process equipment. The Robot’s stability, high accuracy, and efficiency directly impact process stability, yield, and production capacity. Hirokawa’s Vacuum Robots are characterized by high efficiency, precision, and stability. They can be matched to vacuum process equipment requirements or customized in small quantities.
| Item | Specification | |
|---|---|---|
| Wafer Size | 150mm (Tray/Wafer) | |
| Wafer gripping method | Bottom support type | |
| Number of axes | 3-axis | |
| Payload (Standard end effector + wafer) / (Per individual end effector) | 2kg | |
| Motion Range |
R axis (extension) (*1) | -379~505mm (Extension distance varies depending on finger configuration) |
| T axis (rotation) | 360° (continuous rotation) | |
| Z axis (lift) | 40mm | |
| Repeat positioning accuracy | R(Radial)≤0.05mm(3σ) | |
| θ(Rotational)≤0.1mm(3σ) | ||
| Z(vertical)≤0.1mm(3σ) | ||
| Mounting method | Top Mount/Top Bolt | |
| Maximum rotation diameter (*2) | Φ630mm | |
| Vacuum Level | ≤1.33x10-6 Pa | |
| Body Weight | 30kg | |
*1、The extension length value is measured when using Hirokawa standard end effector.
*2、According to the Hirokawa’s standard end effector, the minimum rotary diameter is 630 mm. The rotary diameter will vary with different finger lengths.
| Item | Specification | |
|---|---|---|
| Applicable wafer dimensions | 200mm/300mm | |
| Motion Range |
(R axis) Retraction Range (*1) | 951mm (including Termination Actuator) (extension distance varies based on finger variations) |
| (TH axis) rotation range | 360° (continuous rotation) | |
| (Z axis) lift range | 150mm | |
| Mounting method | Top Mount and Top Bolt | |
| Body Weight | 120kg | |
| Vacuum Level | ≤3E-8Torr | |
| Leak rate | ≤5E-9std·cc/s He | |
| Repeat positioning accuracy | R(Radial)≤0.1mm(3σ) | |
| θ(Rotational)≤0.1mm(3σ) | ||
| Z(vertical)≤0.05mm(3σ) | ||
| Communication protocol | Ethernet(TCP/IP) | |
*1、 The extension length value is measured when using Hirokawa standard end effector.
| Item | Specification | |
|---|---|---|
| Applicable wafer dimensions | 300mm/200mm | |
| Motion Range |
(R axis) Retraction Range(*1) | 968 mm (including end effector) (extension distance varies based on finger variations) |
| (TH axis) rotation range | 360° (continuous rotation) | |
| (Z axis) lift range | 150mm | |
| Maximum rotation diameter(*2) | ∅855mm | |
| Body Weight | 110kg | |
| Vacuum Level | ≤7.5E-5Torr | |
| Leak rate | ≤5E-9std·cc/s He | |
| Repeat positioning accuracy | R(Radial)≤0.05mm(3σ) | |
| θ(Rotational)≤0.1mm(3σ) | ||
| Z(vertical)≤0.05mm(3σ) | ||
| Communication protocol | Ethernet(TCP/IP) | |
*1、The extension length value is measured when using Hirokawa standard end effector.
*2、According to the Hirokawa’s standard end effector, the minimum rotary diameter is 630 mm. The rotary diameter will vary with different finger lengths.
