Hirokawa delivers transmission solutions for a wide range of semiconductor process equipment
EFEM is an important front-end module of semiconductor process equipment. The stability and efficiency of wafer transfer by the EFEM directly affect the overall equipment performance and yield. Hirokawa’s EFEM is equipped with a self-developed robot, featuring high stability and high efficiency, and has been widely applied in advanced semiconductor equipment.
| Item | Specification |
|---|---|
| Product | 2Ports EFEM |
| Model | GE02 |
| Dimensions (mm) | W1600 D820(+451)H2200 |
| Number of Ports | 2 |
| Substrate | 300 mm silicon wafer (Diameter: 300 mm ±0.2 mm Thickness: 775 μm) |
| Corresponding Carrier | 300mm FOUP, 300mm Auto FOSB |
| Cleanliness | ISO Class1 |
| Robot | GM124ANE/GM124ANV |
| Pre Aligner | PER1130/PVR1130 |
| Robot Controller | SR100 |
| Loadport | Chinese-made or Japanese-made |
| FFU | ULPA 99.99995% at 0.1~0.2μm |
| Carrier ID | RFID, Barcode optional |
| Wafer ID Code | SEMI-T7, M12, M13, M1.15 |
| Power supply voltage | Single-phase 220V, 50Hz, 3KVA |
| AIR | ONE TOUCH φ6 0.6MPa~1.0MPa 100L/min |
| VAC | ONE TOUCH φ8 -100kPa to -80kPa, 35L/min |
| Item | Specification |
|---|---|
| Product | 3Ports EFEM |
| Model | GE03 |
| Dimensions (mm) | W2100 D820(+451)H2200 |
| Number of Ports | 3 |
| Substrate | 300 mm silicon wafer (Diameter: 300 mm ±0.2 mm Thickness: 775 μm) |
| Corresponding Carrier | 300mm FOUP, 300mm Auto FOSB |
| Cleanliness | ISO Class1 |
| Robot | GM124ANE/GM124ANV |
| Pre Aligner | PER1130/PVR1130 |
| Robot Controller | SR100 |
| Loadport | Chinese-made or Japanese-made |
| FFU | ULPA 99.99995% at 0.1~0.2μm |
| Carrier ID | RFID, Barcode optional |
| Wafer ID Code | SEMI-T7, M12, M13, M1.15 |
| Power supply voltage | Single-phase 220V, 50Hz, 3KVA |
| AIR | ONE TOUCH φ6 0.6MPa~1.0MPa 100L/min |
| VAC | ONE TOUCH φ8 -100kPa to -80kPa, 35L/min |
| Item | Specification |
|---|---|
| Product | 4Ports EFEM |
| Model | GE03 |
| Dimensions (mm) | W2600 D820(+451)H2200 |
| Number of Ports | 4 |
| Substrate | 300 mm silicon wafer (Diameter: 300 mm ±0.2 mm Thickness: 775 μm) |
| Corresponding Carrier | 300mm FOUP, 300mm Auto FOSB |
| Cleanliness | ISO Class1 |
| Robot | GM124ANE/GM124ANV |
| Pre Aligner | PER1130/PVR1130 |
| Robot Controller | SR100 |
| Loadport | Chinese-made or Japanese-made |
| FFU | ULPA 99.99995% at 0.1~0.2μm |
| Carrier ID | RFID, Barcode optional |
| Wafer ID Code | SEMI-T7, M12, M13, M1.15 |
| Power supply voltage | Single-phase 220V, 50Hz, 3KVA |
| AIR | ONE TOUCH φ6 0.6MPa~1.0MPa 100L/min |
| VAC | ONE TOUCH φ8 -100kPa to -80kPa, 35L/min |
