Exhibition EventTransmission drives "core" speed: Hirokawa invites you to CSEAC 2025

Transmission drives "core" speed: Hirokawa invites you to CSEAC 2025

September 4th to 6th, 2025. /Wuxi Taihu International Expo Center

September 4-6

The 13th Semiconductor Equipment & Core Components & Materials Show

Wuxi, China


The 13th Semiconductor Equipment & Core Components & Materials Exhibition will be held at Wuxi Taihu International Expo Center from September 4th to 6th, 2025. Shanghai Hirokawa Technology Co., Ltd. will participate with core technologies to explore new opportunities for semiconductor development!


Booth No.

A3-110


-PRODUCTS-


As an innovative force in the field of semiconductor wafer transmission, Shanghai Hirokawa Technology will showcase its self-developed key transmission equipment, enabling full control of the industrial chain.



Semiconductor front-end automation equipment

High cleanliness
High productivity
high reliability
customization



GVM series vacuum robots

Anti-corrosion and automatic
deviation correction
can be adapted to high vacuum environments
in accordance with SEMI S2 standards



Yaskawa Delivery control products

Advanced delivery performance
high mechanical precision
stable drive


-GUIDELINE-



-INVITATION



Transmit drive "core" speed; From September 4th to 6th, Hirokawa invites you to join us in seeking technological breakthroughs, sharing the opportunities of The Times, and drawing a grand blueprint for China's semiconductor industry!